Rakon推出面向云数据中心和下一代电信网络的小型IC-OCXO，支持8小时延期
随着5G/5G Advanced和工业5.0的发展，以及无线接入网络的开放，数据中心在新兴网络架构中发挥着重要作用。
与传统应用程序不同，数据中心的新应用程序有严格的同步要求。基于服务器的DU同步部署需要能够承受数据中心恶劣环境的低功耗和小尺寸组件。
XMEMS支持的Rakon基于IC的频率控制设备®基于的谐振器能够抵御冲击和振动，并在小尺寸和低功耗下提供高稳定性性能。
定制的MercuryX产品通过先进的I C总线数字控制、GNSS 1PPS输入和/或机器学习进一步优化了长期稳定性。
我们的小尺寸OCXOs基于领先的专有Mercury和Mercury+技术。它们在整个温度范围内具有出色的频率稳定性。MercuryX是Rakon的首款OCXO，采用了其专有的Mercury ASIC和XMEMS谐振器技术，增强了稳定性和保持性能。例如，ROM1490X有源晶振在-40°C至+95°C温度范围内实现了1.5ppb的频率稳定性，保持时间为8小时，频率老化为0.2ppb/天。
这种高度集成的基于ASIC的OCXO设计具有最少的互连数量，从而显著提高了可靠性，并因此降低了设备的总拥有成本(TCO)。
应用程序:Data中心同步，5G基站和小型蜂窝、5G高级、6G无线接入网络(RAN)、网络定时、3E同步(IEEE1588，SyncE)、5G RRHs、光网络和微波传输系统。
Rakon推出了首款集成电路ROM1490X支持8小时延期
Rakon launches Small Form Factor IC-OCXO with 8hr holdover for cloud data centres and next-generation telecom networks
Rakon has launched its first IC-OCXO products combining its in-house designed Mercury™ semiconductor chip and XMEMS® resonators under the brand MercuryX™. MercuryX OCXOs provide ultra-high stability and an extended holdover of 8 hours. in real-world conditions, all in a small form factor package size. The new OCXOs are an excellent fit for timing and synchronisation in AI computing / data centres and 5G, 5G Advanced and 6G telecommunications networks as well as satellite terminals and instrumentation.
Reza Sedehi, Head of Product Management at Rakon says: “The MercuryX products showcase the performance gains that are possible with next-generation quartz technology such as XMEMS. The initial 1000+ samples of MercuryX have generated high interest and positive feedback from tier-1 customers. The new products build on Rakon’s successful track record of consistently delivering high-quality ASIC based OCXOs (IC-OCXOs) in large volumes for over a decade.”
MercuryX follows the launch of Niku™, Rakon’s latest in-house designed ASIC semiconductor chip for Ultra Stable TCXOs, as the next entry in the company’s AI computing product portfolio.
The new MercuryX OCXOs offer a three-fold performance improvement on the current IC-OCXO range in terms of stability (±1.5 ppb), frequency slope (0.05 ppb/°C) and ageing (0.2 ppb/day). Even more importantly, MercuryX satisfies the much sought-after holdover requirements (8 hrs) for data centres and advanced telecom networks.
The development of its own in-house resonator and chip technology allows Rakon to control its product roadmap, creating market-leading products like MercuryX that are independently manufactured in its factories in New Zealand and India, providing customers with high security of supply.
The first product in the range is the ROM1490X in a 14 x 9 mm package, to be followed by a 7 x 5 mm product in mid 2024. Rakon is already working on the next iteration of the Mercury chip, with a new ASIC to be released in 2025 for further performance gains.
Rakon推出了首款集成电路ROM1490X支持8小时延期
Key performance parameters of the ROM1490X:
Package: 14.2 x 9.2 x 6.5 mm, 6-pad, SMD
Frequency (Fn): 10 to 50 MHz
Operating temperature: - 40 to 95°C
Frequency stability (FvT): ±1.5 ppb
Holdover: 8 hrs
Frequency slope (ΔF/ΔT): 0.05 ppb/°C
Ageing: 0.2 ppb/day
G-sensitivity: 0.9 ppb/g
Custom MercuryX products with further optimised long-term stability through advanced I²C bus digital control, GNSS 1PPS input and/or machine learning are available on request.
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